LIEKETSENG MOTS'OANE

SILICON WAFERS |MOSEBETSI OA MOTLATSI

Kakaretso

Tsoelo-pele ea ho etsa li-wafer, papiso, MEMS le nanomanufacturing e kentse mehla e mecha indastering ea semiconductor.Leha ho le joalo, ho fokotsoa ha sephaphatha sa silicon ho ntse ho etsoa ka ho roala ka mochini le ho bentša ka nepo.Leha palo ea lisebelisoa tsa elektroniki, joalo ka tse sebelisoang tlhahisong ea PCB, e eketsehile haholo, liphephetso mabapi le botenya le boima bo behiloeng li ntse li le teng.

MELEMO EA QUAL DIAMOND SLURRY LE PORO

Likaroloana tsa daemane tsa Qual Diamond li alafshoa ka k'hemistri ea proprietary surface.Li-matrix tse entsoeng ka mokhoa o ikhethileng li etselitsoe lirafshoa tse fapaneng tsa daemane bakeng sa lits'ebetso tse fapaneng.Mekhoa ea rona ea taolo ea boleng e tsamaellanang le ISO, e kenyelletsang liprothokholo tse thata tsa boholo le tlhahlobo ea mantlha, e netefatsa kabo e tiileng ea boholo ba daemane le bohloeki bo phahameng ba taemane.Melemo ena e fetolela ho sekhahla sa ho tlosa thepa ka potlako, katleho ea ho mamellana, liphetho tse tsitsitseng, le ho boloka litšenyehelo.

● Non-agglomeration ka lebaka la phekolo e tsoetseng pele ea holim'a likaroloana tsa daemane.

● Kabo ea boholo bo thata ka lebaka la liprothokholo tse thata.

● Bohloeki ba daemane bo phahameng ka lebaka la taolo e thata ea boleng.

● Sekhahla se phahameng sa ho tlosoa ha thepa ka lebaka la ho se kopane ha likaroloana tsa daemane.

● E entsoe ka ho khetheha bakeng sa ho bentša ka mokhoa o nepahetseng ka lentsoe, poleiti le pad.

● Motsoako o bolokang tikoloho o hloka feela metsi bakeng sa mekhoa ea ho hloekisa

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Computer Electronic Components
Silicon plate with processor cores isolated on white background
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SILICON WAFER LAPPING LE POLISH

Li-wafers tsa silicon li sebelisoa haholo indastering ea semiconductor.Tlhokahalo ea botenya bo ts'oanang ho isa pheletsong ea sekhechana sa mosebetsi se bolela mamello e tiileng bakeng sa ho roala le ho belisoa ka nepo mme e ntse e le phephetso e kholo.Botenya bo sa lekanngoeng ba mochini bo boetse bo bonoa ho sebelisoa theknoloji ea ho lemoha ka bohale ho liboto tsa PCB, li-hard drive, li-peripheral tsa khomphutha, le likarolo tse ling tsa elektroniki mme e ntse e le karolo e thata ea tlhahiso.Mechini e mengata e sebelisoang ho roala le ho bentša ka nepo liphaephe tsa silicon ke mechini e benyang ea polanete ka botlalo.Li etselitsoe boholo bo fapaneng ba li-wafers 'me li na le bokhoni ba ho tsamaisa slurry ka boiketsetso.

Diamond slurry ke sesebelisoa se hloahloa sa ho tlosa le ho tšesaane bakeng sa semiconductor le likarolo tsa elektroniki.Joalo ka lisebelisoa tse thata ka ho fetesisa lefatšeng, likaroloana tsa daemane tse seretse li fana ka ts'ebetso e phahameng ea ho tlosa le ho qeta holimo ka mokhoa o ikhethang.Wafer thinning e ka qala ka planarization ka daemane slurries ea boholo bo boholo ba grit, e lateloe ke sub-micron size slurries bakeng sa mekhahlelo ea ho qetela ea ho belisoa ka nepo.